This model enables the bottom inspection withoug board flipper. Effective for reducing production facility and man-hours in assembly.

Detects lead bridge, no solder, and solder fillet by simple setting.
Also it detects scattered soler ball on PCB.
Inspection setting can be done only by placing solder ball detection stamp on screen.

Please select RGB lighting model if you require highly accurate inspection on solder fillet.
We also prepare the angular camera mouted model for more accurate inspection by confirming defects by 3D image.
Z axis is mounted as standard that inspection is not affected by heated and warped PCB.