High-density Surface Mounting
Advanced surface mounting machine
for high density and high throughput production
Active facility investment for lightened and miniturized electronic unit and device. Also wide variety of board assembly is possible by selecting the mounter which can flexibly cope with the production status. |
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Machine support the component size from 0402 chip component to 100mm×90mm different shape component.
Minimum lead pitch of different shape component up to 0.4mm, and minimum ball pitch up to 0.3mm. (Coplanarity testing is possible)
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